Welcome to ICNNN 2014
2014-12-01, News, Please download the conference program. (Full version)
2014-11-27, News. Please check the conference program (simple version), the full program can be download around December 1, 2014.
2014-11-13, News. Welcome Prof. A. Sellai and Prof. Ari Handono Ramelan to join the conference committee. (click)
2014-10-27, News, Welcome Prof.Shinn-Fwu Wang and Prof.Liudong Xing to join thye committee.(click)
2014-09-11, News, The last call for paper extends to October 10, 2014.
2014-05-15, The conference will be held in Hong Kong empire hotel-Wan chai. (click)
2014 The 3rd
International Conference on Nanostructures,
Nanomaterials and Nanoengineering (ICNNN 2014) will
be held in Hong Kong, during December 26-28, 2014.
ICNNN 2014 is a part of 2014 WORLD CONGRESS ON
ELECTRONICS AND ELECTRICAL ENGINEERING (WCEEE 2014)
which is sponsored by Science and Engineering
The ICNNN conference is an international forum for the presentation of technological advances and research results in the fields of Nanostructures, Nanomaterials and Nanoengineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome previous and prospected authors submit your new research papers to ICNNN Conference, and share the valuable experiences with the scientist and scholars around the world.
I. All accepted papers of ICNNN 2014 will be published by Advanced Materials Research Journal.
Advanced Materials Research (ISSN: 1022-6680) specializes in the very rapid publication of international conference proceedings and stand-alone volumes on topics of current interest in all areas of materials research and related topics.
Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc. Publishing editor: Thomas Wohlbier, TTP USA, email@example.com. (TTP offical website: http://www.scientific.net/AMR/details)
II. 5% excellent submissions will be offered one more option, to publish the paper in International Journal of Materials Science and Engineering (IJMSE, ISSN:2315-4527), which is free of charge. Ms.Renne Gao will inform those papers on notification day.
Template Download (AuthorInstructions.doc)
Abstract (presentation only), Please send it to email:firstname.lastname@example.org.
|Submission Deadline||Before October 10, 2014|
|Notification Day||Before October 30, 2014|
|Registration Deadline||Before November 15, 2014|
|Conference Date||December 26-28, 2014|